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Electrical Characteristics
2.2
Recommended Operating Conditions
Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed.
Table 3. Recommended Operating Conditions
Core and PLL supply voltage:
? Standard
— 400 MHz
— 500 MHz
? Reduced (300 and 400 MHz)
I/O supply voltage
Input voltage
Rating
Symbol
V DD
V CCSYN
V DDH
V IN
Value
1.14 to 1.26
1.16 to 1.24
1.07 to 1.13
3.135 to 3.465
–0.2 to V DDH +0.2
Unit
V
V
V
V
V
Operating temperature range:
? Standard
? Extended
T J
T J
0 to 90
–40 to 105
°C
°C
Table 4. Thermal Characteristics for the MSC8126
Characteristic
Symbol
FC-PBGA
20 × 20 mm 5
Natural
200 ft/min
Convection
(1 m/s) airflow
Unit
Junction-to-ambient, four-layer board
Junction-to-ambient 1, 2
Junction-to-board (bottom) 4
Junction-to-case 5
Junction-to-package-top 6
1, 3
R θ JA
R θ JA
R θ JB
R θ JC
Ψ JT
26
19
9
0.9
1
21
15
°C/W
°C/W
°C/W
°C/W
°C/W
Notes:
1.
2.
3.
4.
5.
6.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15
14
Freescale Semiconductor
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